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Solution
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BURN-IN


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BURN-IN


BURN-IN SERVICES

WE PROVIDE STATIC BURN-IN, DYNAMIC BURN-IN, TEST DURING BURN-IN AND HIGH POWER BURN-IN SERVICES FOR SEMICONDUCTOR MANUFACTURERS, SERVING THE SEGMENT OF THE INDUSTRY THAT REQUIRES FAIL-SAFE OR HIGH RELIABILITY SEMICONDUCTOR DEVICES INCLUDING MICROPROCESSORS AND MICROCONTROLLERS FOR AUTOMOTIVES INCLUDING ELECTRIC VEHICLES, INTERNET OF THINGS AND NETWORKING PRODUCTS, AND MOBILE DEVICES. OUR PORTFOLIO OF CUSTOMERS SPANS THE ASIA-PACIFIC, EUROPE AND THE UNITED STATES AND INCLUDES SOME OF THE KEY PLAYERS IN THE GLOBAL SEMICONDUCTOR INDUSTRY. 

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BURN-IN BOARDS MANUFACTURING AND PCBA SERVICES


BURN-IN BOARDS MANUFACTURING AND PCBA SERVICES


MANUFACTURING AND PRINTED CIRCUIT BOARD ASSEMBLY (“PCBA”) SERVICES

WE ENGAGE IN THE DESIGN, MANUFACTURE AND ASSEMBLY OF A WIDE RANGE OF BURN-IN BOARDS AND AUTOMATIC TEST EQUIPMENT/LOAD BOARDS FOR THE VARIOUS TYPES OF BURN-IN SYSTEMS AS WELL AS BOARDS FOR OTHER TYPES OF RELIABILITY TESTS SUCH AS HIGH TEMPERATURE OPERATING LIFE TEST AND HIGHLY ACCELERATED STRESS TEST. WE ARE QUALIFIED AND LICENSED TO BUILD BURN-IN BOARDS FOR HIGH POWER DEVICES. IN ADDITION, WE PROVIDE INDUSTRIAL IMAGING AND DIAGNOSTIC SOLUTIONS, DESIGN PRINTED CIRCUIT BOARDS AND PROVIDE NICHE PCBA SERVICES FOR THE MEDICAL, MOBILE COMMUNICATIONS, OPTICS AND AVIATION INDUSTRIES. WE ARE CONSTANTLY CHALLENGING OURSELVES TO RAISE OUR COMPETENCIES IN BOARD DESIGN AND MANUFACTURING, AND ASSEMBLY CAPABILITIES TO MEET THE DYNAMIC AND INCREASINGLY SOPHISTICATED CUSTOMER REQUIREMENTS.

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ENGINEERING


ENGINEERING


ENGINEERING SERVICES

OUR ENGINEERING SERVICES RANGE FROM DESIGN AND DEVELOPMENT TO FULL TURNKEY OUTSOURCED MANUFACTURING AND SYSTEM INTEGRATION FOR SEMICONDUCTOR EQUIPMENT AND LAB AUTOMATION SYSTEMS FOR THE LIFE SCIENCES AND BIOTECH INDUSTRIES. WE ALSO RECOMMEND ENHANCEMENTS AND IMPROVEMENTS TO OUR CUSTOMERS’ DESIGNS AND DESIGN FOR MANUFACTURABILITY AS A VALUE-ADDED SERVICE TO THEM. ONE OF OUR COMPETITIVE STRENGTHS IS THE PROVISION OF SYSTEM INTEGRATION SERVICES FOR REFRIGERATION-BASED HIGH POWER BURN-IN SYSTEMS AND LITHOGRAPHY TOOL FOR SEMICONDUCTOR FRONT-END APPLICATIONS. WE HAVE SIGNIFICANTLY EXPANDED OUR ENGINEERING SERVICES IN THIS AREA OF SPECIALIZATION SINCE 2006. OUR INTEGRATION PROJECTS ALSO INCLUDE CHARGED COUPLED DEVICE CAMERAS FOR ASTRONOMY AND LIFE SCIENCES APPLICATIONS, DIGITAL IMAGERS AS WELL AS CUSTOMIZED LIGHT-EMITTING DIODE DRIVERS AND PRODUCTS FOR VARIOUS APPLICATIONS. IN ADDITION, WE DISTRIBUTE AND SERVICE THIRD-PARTY MIXED SIGNAL TESTERS USED IN THE SEMICONDUCTOR INDUSTRY.